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RF Chips Technolgy,Inc. provides integrated design of RFLSI development from RFLSI concecpt drafting through system design,process&package selection,specifications,circuit design,layout,and test evaluation.We support design possible for all phases of RFLSI.
<RFLSI Development Flow>

RFLSI CONCEPT
RFLSI SYSTEM DESIGN
PROCESS,PACKAGE SELECTION
RFLSI SPECIFICATIONS
RF DESIGN
RF LAYOUT
PACKAGE
WAFER FABRICATION
‚`‚b/‚c‚b TEST
RF TEST EVALUATION
SHIPPING

We support to cultivate design experience by CMOS,SiGe BiCMOS technology
  • W-LAN 2.4GHz/5GHz
        SiGe BiCMOS 0.5um
  • Video transmission
        rfcmos/0.13um
  • quasi-milliwave impulse Communication
        rfcmos/90nm
  • milliwave Communication
        rfcmos/65nm
Industry Experience:
semiconductor process
communication/transmission@system
Industry Experience:semiconductor process
  • 65nm RF-CMOS(Japanease manufacturer)
  • 90nm RF-CMOS(Japanease manufacturer TSMC)
  • 0.13ƒÊm RF-CMOS(Japanease manufacturer,TSMC)
  • 0.18ƒÊm RF-CMOS(Japanease manufacturer,TSMC,former Chartered)
  • 0.22ƒÊm RF-CMOS (Japanease manufacturer)
  • 0.36ƒÊm RF-CMOS (Japanease manufacturer)
  • 0.5ƒÊm RF-CMOS (Japanease manufacturer)
  • 0.13ƒÊm SiGe BiCMOS (IBM)
  • 0.18ƒÊm SiGe BiCMOS (Japanease manufacturer,IBM)
  • 0.25ƒÊm SiGe BiCMOS (Japanease manufacturer)
  • 0.5ƒÊm SiGe BiCMOS (Japanease manufacturer,IBM)
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Industry Experience:communication/transmission@system
  • Quasi-milliwave radar system
  • Milliwave band communication system
  • Cognitive wideband wireless system
  • Contactless Gbit transmmision system
  • 3GPP communication system
  • DTV system
  • Specified Low Power Radio system
  • 5GHz band wireless LAN system
  • 2.4GHz band wireless LAN system
  • Other
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Keyword for Industry Experience
  • Direct Conversion
  • Low-IF
  • Sliding-IF
  • AGC
  • Distributed Amplifer
  • Complex BPF
  • Passive component on chip LPF,BPF
  • 15GHz@VCO/PLL
  • 6GHz Dual modulus prescaler
  • Milliwave/Quasi-milliwave analog circuit
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